Compatible with 3GPP TS25.102 Power Class 2 (+24dBm).
●
Realizes industry's smallest size of 13.0×9.0×1.5mm (W×D×H).
●
Stable high output and low-noise design for exceptional linearity.
●
Shield configuration with adoption of metal cover.
●
For RoHS and lead-free soldering.
Applications
●Mobile phones, smart phones, data cards, etc.
Typical Specifications
Items
min.
typ.
max.
Operating temperature
-30°C
-
+85°C
Frequency
2010MHz min.
-
2025MHz max.
Supply voltage PA
3.2V
3.5V
4.2V
Supply voltage RF
2.75V
2.85V
2.95V
Transmission output
26.5dBm/BW
-
-
Power leaked to adjacent channel (ACLR 1.6MHz offset)
-
-38dBc
-34dBc
Reception output NF
-
4.7dB
-
Dimensions (W×D×H)
13.0×9.0×1.5mm
Dimensions
Unit: mm
Example of circuit configuration
Cautions for Use
1.
The specifications herein are an overview of the specifications. Obtain official specifications before use.
2.
Unless specifically indicated otherwise, products herein have been designed and manufactured for use in ordinary
electronic equipment, such as AV equipment, electric home appliances, office machines and communication
equipment. In case of using the products for highly sensitive applications such as medical, aviation, aerospace and
security, the set makers shall require to include measures necessary to meet product safety requirements of such
specific applications. Such measure may include additional protection circuits and redundant circuits, for example.
3.
The external appearance, performances, and other properties of the product are subject to change for
improvement without prior notice. The product introduced .in this catalog may be discontinued without prior notice.
4.
All product names, company names and names of standards described in this catalog are trademarks or registered
trademarks of their respective owners.
5.
Contact us for any enquiries and queries on our products and their uses.
6.
This catalog is valid till the end of December 2008.
> Communication Use RF Devices
> China's 3G, RF Module for TD-SCDMA UMLC1-111B
Inquiry
Applications
