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> SKSC Series > SKSCPDE010
Related information
｜Dimensions ｜Land Dimensions ｜Circuit Diagram ｜Soldering Conditions ｜Taping Specifications ｜

1.25mm Height Low-profile Side-push™ TACT Switch™ (Surface mount) SKSC Series

Detail

With Ground Terminal Type

Model No. SKSCPDE010

Type Surface mount
Operating force 1.6N
Operating direction Horizontal
Travel 0.2mm
Operating life
(5mA 5V DC) 		100,000 cycles
Initial contact resistance 100mΩ max.
Variety With guide bosses
Minimum packing unit (pcs.) Refer to taping specifications

Series type Sharp feeling type
Operating temperature range -10℃ to +60℃
Rating (max.) 50mA 12V DC
Rating (min.) 10µA 1V DC
Electrical performance Insulation resistance 100MΩ min. 100V DC
Voltage proof 100V AC for 1 minute
Durability Vibration 10 to 55 to 10Hz/min., the amplitude is 1.5mm for all the frequencies, in the 3 direction of X, Y and Z for 2 hours respectively
Environmental performance Cold -30±2℃ for 96h
Dry heat 80±2℃ for 96h
Damp heat 60±2℃, 90 to 95%RH for 96h

Dimensions

TACT Switch(TM)

Land Dimensions

TACT Switch(TM)

 
Viewed from mounting face.

Circuit Diagram

TACT Switch(TM)


Soldering Conditions

Condition for Reflow
1. Heating method
Double heating method with infrared heater.
2. Temperature measurement
Thermocouple 0.1 to 0.2 Φ CA(K) or CC(T) at solder joints (copper foil surface). A heat resisting tape should be used for fix measurement.
3. Temperature profile
(1) The above temperature shall be measured on the mounting surface of a PC board. There are cases where PC board's temperature greatly differs from that of the switch, depending on the material, size, thickness of PC board's and others. Care, should be taken to prevent the switch's surface temperature from exceeding 260℃.
(2) Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended.
Manual Soldering
1. Consult with us for TACT switchTM washing conditions.
2. Prevent flux penetration from the top side of the TACT switchTM.
3. Switch terminals and a PC board should not be coated with flux prior to soldering.
4. The second soldering should be done after the switch returns to normal temperature.

Taping Specifications

Taping Packaging for Auto-insertion
Reel Size
Reel Width W (mm) 13.5
Qty/reel (pcs.)
(Minimum packing unit) 		5,000
Tape dimensions

Notes are common to this series/models.
  • Ground terminal is made of non-solderable material.
    In case extra solder paste is applied to the gap between land and ground terminal, the recommended pattern and 0.15mm stencil must be used.
  • For surface mount type, 1-reel is the minimum packing units. (Please see taping specifications)
  • Please place purchase orders for taping products per minimum package units (1 reel or a case). For samples limited to technical consideration, we will comply with quantity of 200 units or less. (In simplified packing: may not be mountable to some automatic inserting machines)
  • Ask us for the export packaging unit.
Inquiries about Products
For more information please contact: Products Information Center.
1-7, Yukigaya-otsuka-machi, Ota-ku, Tokyo, 145-8501, Japan
Phone: +81 (3) 5499-8154
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