ALPS Manufacturer of Electronic Components/Parts Catalog

Low-profile 4-direction with Center-push Function (Surface Mount Type) SKRV Series

Detail

Model No. SKRVABE010

Type Surface mount
Operating force 4-direction 1.2N
Center push 2.4N
Travel 4-direction 0.25mm
Center push 0.15mm
Operating life
(5mA 5V DC)
200,000 cycles for each direction
Initial contact resistance 500mΩ max.
Guide bosses With
Minimum packing unit (pcs.) 1,500

Operating temperature range -20℃ to +70℃
Ratings (max.)/(min.) (Resistive load) 50mA 12V DC/10μA 1V DC
Electrical performance Directional resolution 4-direction
Insulation resistance 100MΩ min. 100V DC
Voltage proof 100V AC for 1 minute
Mechanical performance Direction application force 1.2±0.6N
Push application force 2.4±0.69N
Robustness of terminal 29.4N for 5s
Solder heat resistance Manual soldering 350℃ max. 3s max.
Reflow soldering Refer to soldering conditions
Durability Vibration 10 to 55 to 10Hz/min., the amplitude is 1.5mm for all the frequencies, in the 3 direction of X, Y and Z for 2 hours respectively
Operating life Directions 200,000 cycles
Center push 200,000 cycles
Environmental performance Cold -30±2℃ for 96h
Dry heat 85±2℃ for 96h
Damp heat 60±2℃, 90 to 95%RH for 96h

Dimensions

Multi Control Devices

Land Dimensions

Multi Control Devices

 
Viewed from mounting face.

Circuit Diagram

Multi Control Devices


Soldering Condition

Example of Reflow Soldering Condition (Reference)
1. Heating method
Double heating method with infrared heater.
2. Temperature measurement
Thermocouple 0.1 to 0.2 Φ CA (K) or CC (T) at solder joints (copper foil surface). A heat resisting tape should be used to fix thermocouple.
3. Temperature profile
(1) The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where PC board's temperature greatly differs from that of the switch, depending on the PC board's material, size, thickness, etc. Care, should be taken to prevent the switch's surface temperature from exceeding 260°C.
(2) Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended.
1. Consult with us for TACT switchTM washing conditions.
2. Prevent flux penetration from the top side of the TACT switchTM.
3. Switch terminals and a PC board should not be coated with flux prior to soldering.
4. The second soldering should be done after the switch returns to normal temperature.

Examples of Custom Products

Examples of Multi Control by Combination of Standard Products


Operation Image   Component of Products    

Features

The combination of a mid-size hollow pulse switch and a 4-directional TACT switchTM will enable integration of operation system.
Applications
Car audio, home telephone, mini-components, etc.


Taping Specifications

Taping Packaging
Reel Size
Number of Packages
1 reel
1,500
Number of Packages
1 case (shipment within Japan)
12,000
Number of Packages
1 case (shipment outside of Japan)
12,000
Reel Width W (mm) W = 17.5
Tape width (mm) 16
 
Please place purchase orders for taping products per minmium package units (1 reel or a case).
Notes are common to this series/models.
  • Please place purchase orders for taping products per minimum package units (1 reel or a case). Please see taping specifications.
  • Ask us for the export packaging unit.
  • Please always solder the frame to secure switch intensity.
Inquiries about Products
For more information please contact: Products Information Center.
1-7, Yukigaya-otsuka-machi, Ota-ku, Tokyo, 145-8501, Japan
Phone: +81 (3) 5499-8154
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