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Operating temperature range
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-30℃ to +85℃
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Ratings (max.)/(min.) (Resistive load)
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50mA 12V DC/10µA 1V DC
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Electrical performance
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Directional resolution
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4-direction
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Insulation resistance
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100MΩ min. 100V DC
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Voltage proof
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100V AC for 1 minute
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Mechanical performance
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Direction application force
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1.23±0.69N
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Push application force
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2.35±0.69N
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Robustness of terminal
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29.4N for 5s
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Solder heat resistance
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Manual soldering
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350℃ max. 3s max.
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Reflow soldering
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Refer to soldering conditions
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Durability
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Vibration
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10 to 55 to 10Hz/min., the amplitude is 1.5mm for all the frequencies, in the 3 direction of X, Y and Z for 2 hours respectively
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Operating life
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Directions
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200,000 cycles
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Center push
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200,000 cycles
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Environmental performance
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Cold
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-30±2℃ for 96h
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Dry heat
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85±2℃ for 96h
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Damp heat
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60±2℃, 90 to 95%RH for 96h
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Example of Reflow Soldering Condition (Reference)
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Double heating method with infrared heater.
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2. Temperature measurement
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Thermocouple 0.1 to 0.2 Φ CA (K) or CC (T) at solder joints (copper foil surface). A heat resisting tape should be used to fix thermocouple.
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(1) The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where PC board's temperature greatly differs from that of the switch, depending on the PC board's material, size, thickness, etc. Care, should be taken to prevent the switch's surface temperature from exceeding 260°C.
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(2) Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended.
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1. Consult with us for TACT switchTM washing conditions.
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2. Prevent flux penetration from the top side of the TACT switchTM.
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3. Switch terminals and a PC board should not be coated with flux prior to soldering.
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4. The second soldering should be done after the switch returns to normal temperature.
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Related information
Detail
