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> SKQU Series > SKQUDBE010
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｜Photo ｜Dimensions ｜Land Dimensions ｜Circuit Diagram ｜Soldering Condition ｜
｜Taping Specifications ｜

4-direction with Center-push Function (SMD & Snap-in Type) SKQU Series

Detail

With Center Push Type

Model No. SKQUDBE010

Type Surface mount
Operating force 4-direction 1.57N
Center push 3.14N
Travel 4-direction 0.4mm
Center push 0.2mm
Operating life
(5mA 5V DC) 		100,000 cycles for each direction
Initial contact resistance 500mΩ max.
Minimum packing unit (pcs.) 600

Operating temperature range -30℃ to +85℃
Ratings (max.)/(min.) (Resistive load) 50mA 12V DC/10µA 1V DC
Electrical performance Directional resolution 4-direction
Insulation resistance 100MΩ min. 100V DC
Voltage proof 250V AC for 1 minute
Mechanical performance Direction application force 1.57(+0.39, -0.69)N
Push application force 3.14±0.59N
Robustness of terminal 49N for 1 minute
Solder heat resistance Manual soldering 350℃ max. 3s max.
Reflow soldering Refer to soldering conditions
Durability Vibration 10 to 55 to 10Hz/min., the amplitude is 1.5mm for all the frequencies, in the 3 direction of X, Y and Z for 2 hours respectively
Operating life Directions 100,000 cycles
Center push 100,000 cycles
Environmental performance Cold -30±2℃ for 96h
Dry heat 80±2℃ for 96h
Damp heat 60±2℃, 90 to 95%RH for 96h

Photo

Multi Control Devices

Dimensions

Multi Control Devices

Land Dimensions

Multi Control Devices

 
Viewed from mounting face.

Circuit Diagram

Multi Control Devices


Soldering Condition

Example of Reflow Soldering Condition (Reference)
1. Heating method
Double heating method with infrared heater.
2. Temperature measurement
Thermocouple 0.1 to 0.2 Φ CA (K) or CC (T) at solder joints (copper foil surface). A heat resisting tape should be used to fix thermocouple.
3. Temperature profile
(1) The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where PC board's temperature greatly differs from that of the switch, depending on the PC board's material, size, thickness, etc. Care, should be taken to prevent the switch's surface temperature from exceeding 260°C.
(2) Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended.
1. Consult with us for TACT switchTM washing conditions.
2. Prevent flux penetration from the top side of the TACT switchTM.
3. Switch terminals and a PC board should not be coated with flux prior to soldering.
4. The second soldering should be done after the switch returns to normal temperature.

Taping Specifications

Taping Packaging for Auto-insertion
Reel Size
Number of Packages
1 reel 		600
Number of Packages
1 case / domestic 		2,400
Number of Packages
1 case export packing 		2,400
Reel Width W (mm) W = 33.5
Tape dimensions
Tape width (mm) 32
 
Please place purchase orders for taping products per minmium package units (1 reel or a case).

Notes are common to this series/models.
  • For SKQUAA, and SKQUBA models, the 4-directional operating force and travel are measured 0.9mm below the top of the stem.
  • For SKQUCA models, the 4-drectional operating force and travel are measured 2.9mm below the top of the stem.
  • For SKQUDB models, the 4-drectional operating force and travel are measured 1.5mm below the top of the stem.
  • Place your purchase order in N minimum package units (N: integer).
  • Ask us for the export packaging unit.
  • For surface mount type, 1-reel is the minimum packing units. (Please see taping specifications)
  • Using a 1.6mm thick PC board is recommended. (Snap-in type.)
Inquiries about Products
For more information please contact: Products Information Center.
1-7, Yukigaya-otsuka-machi, Ota-ku, Tokyo, 145-8501, Japan
Phone: +81 (3) 5499-8154
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