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1.
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Appling load to terminals during soldering under certain conditions may cause deformation and electrical property degradation.
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2.
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Avoid use of water-soluble soldering flux, since it may corrode the switches.
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3.
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Check and conform to soldering requirements under actual mass production conditions.
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4.
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When soldering twice, wait until the first soldered portion cools to normal temperature. Continuous heating will deform the external portions, loosen or dislodge terminals, or may deteriorate their electrical characteristics.
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5.
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Flux from around and above the PC board should not adhere to the switches.
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6.
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After mounting the switches, if you intend to put the board into an oven in order to harden adhesive for other parts, please consult with us.
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7.
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Before soldering switches with locking mechanism, release the locks. If they are soldered without releasing the locks, the soldering heat may deform the locking mechanism.
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8.
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If you use a through-hole PC board or a PC board thinner or thicker than the recommendation, here may be greater heat stress. Verify the soldering conditions thoroughly before use.
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9.
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Solder the switches with detent at the detent position. Soldering switches fixed at the center of the detent may deform the detent mechanisms.
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11.
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Protect small and thin switches from external forces in the set mounting process.
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12.
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Tighten the mounting screws by applying the specified torque. Tightening with larger torque than the specified one will result in malfunction or breakage of screws.
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13.
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The products are designed and manufactured for direct current resistance. Contact us for use of other resistances such as inductive(L)or capacitive(C).
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14.
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The switch will be break if you apply a greater stress than that specified. Take great care not to let the switch be subject to greater stress than specified.
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15.
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Be sure to release the locks before removing the knobs. Otherwise, the locking mechanism may be deformed.
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16.
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Be sure to use the forced travel close to the position of the whole travel as mush as possible.
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17.
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Insert these switches to the specified mounting surface and mount them horizontally. If not mounted horizontally, these switches will malfunction.
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18.
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Use of the switches in a dusty environment may lead the dusts entering through the openings and cause imperfect contact or malfunction. Take this into account for set design.
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19.
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Corrosive gas if generated by peripheral parts of a set, malfunction such as imperfect contact may occur. Thorough investigation shall be required beforehand.
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(1) Store the products as delivered, at a normal temperature and humidity, without direct sunshine and corrosive gas ambient. Use them at an earliest possible timing, not later than six months upon receipt.
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(2) After breaking the seal, keep the products in a plastic bag to shut out ambient air, store them in the same environment as above, and use them up as soon as possible.
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(3) Do not stack too many switches.
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