ALPS Manufacturer of Electronic Components/Parts Catalog

Horizontal Type Double Action Push Switch SPEE Series

Detail

Model No. SPEE120100

Travel 1st 0.3mm
2nd 0.71mm
Total travel 0.9mm
Mounting method PC board
Poles 1
Operating force 1st 1.75N
2nd 1.1N
Positions 2
Terminal style For PC board (Reflow)
Minimum packing unit (pcs.) 3,500

Operating temperature range -10℃ to +60℃
Ratings (max.)/(min.) (Resistive load) 20mA 5V DC/100µA 3V DC
Electrical performance Contact resistance (Initial performance/After lifetime) 1V or less, at the present rating of 1mA 5V DC for output voltage.
Insulation resistance 10MΩ min. 100V DC
Voltage proof 100V AC for 1 minute
Mechanical performance Actuator strength Operating direction 50N
Vibration 10 to 55 to 10Hz/min., the amplitude is 1.5mm for all the frequencies, in the 3 direction of X, Y and Z for 2 hours respectively
Resistance to soldering heat Manual soldering 350±10℃, 4(+1, 0)s
Reflow soldering Refer to soldering conditions
Durability Operating life without load 100,000 cycles
Operating life with load (Load: as ratings) 100,000 cycles
Environmental performance Cold -40±2℃ for 96h
Dry heat 85±2℃ for 96h
Damp heat 40±2℃, 90 to 95%RH for 96h

Dimensions

Push Switches

Land Dimensions

Push Switches

 
Viewed from direction A in the dimensions.

Out Put Chart

Push Switches

Circuit Diagram

Push Switches

 
Viewed from direction A in the dimensions.

Soldering Conditions

Condition for Reflow
1. Heating method
Double heating method with infrared heater.
2. Temperature measurement
Thermocouple 0.1 to 0.2 Φ CA(K) or CC(T) at soldering portion(copper foil surface).A heat resisting tape should be used for fixed measurement.
3. Temperature profile
(1) The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where PC board's temperature greatly differs from that of the switch, depending on the PC board's material, size, thickness, etc. The above-stated conditions shall also apply to switch surface temperatures
(2) Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended.
1. Consult with us for TACT switchTM washing conditions.
2. Prevent flux penetration from the top side of the TACT switchTM.
3. Switch terminals and a PC board should not be coated with flux prior to soldering.
4. The second soldering should be done after the switch returns to normal temperature.

Taping Specifications

Taping Packaging
Reel Size
Number of Packages
1 reel
3,500
Number of Packages
1 case (shipment within Japan)
7,000
Number of Packages
1 case (shipment outside of Japan)
14,000
Reel Width W (mm) 16.4
Tape width (mm) 16
 
1. Please place purchase orders for taping products per minimum package units(1 reel or a case).
Notes are common to this series/models.
  • Please place purchase orders for taping products per minimum package units (1 reel or a case). Please see taping specifications.
  • Ask us for the export packaging unit.
  • Products other than those listed in the above chart are also available. Please contact us for details.
Inquiries about Products
For more information please contact: Products Information Center.
1-7, Yukigaya-otsuka-machi, Ota-ku, Tokyo, 145-8501, Japan
Phone: +81 (3) 5499-8154
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