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1.
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Appling load to terminals during soldering under certain conditions may cause deformation and electrical property degradation.
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2.
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Avoid use of water-soluble soldering flux, since it may corrode the switches.
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3.
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Check and conform to soldering requirements under actual mass production conditions.
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4.
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In soldering twice, make sure the solder joints should go down to normal temperature. Continuing heating will cause deformation of switch, loose and fracfored terminals, or may deteriorate electrical characteristics.
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5.
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Flux from around and above the PC board should not adhere to the switches.
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6.
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For the sizes of holes and patterns on a PC board for mounting a switch, refer to the recommended dimensions in the outline drawings.
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7.
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This switch is designed for manually operated units. Must not use this switch for a mechanical detection unit. For detection purposes, please use our detection switches.
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8.
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After mounting the switches, if you intend to put the board into an oven in order to harden adhesive for other parts, please consult with ALPS.
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9.
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Use of a through-hole PC board, or a PC board of different thickness from the recommendation will have a different heat stress. Verify the soldering requirements thoroughly before use.
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10.
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Solder the switches with detent at the detent position. Soldering switches fixed at the center of the detent may deform the detent mechanisms.
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12.
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Protect small and thin switches from external forces in the set mounting process.
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13.
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Tighten the mounting screws by applying the specified torque. Tightening with a larger torque than the specified one will result in malfunction or breakage of screws.
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14.
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Use of the switches with voltage below 1V DC or current below 10μA may make contacts unstable.
When using these switches in this way, please consult with us beforehand.
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15.
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The products are designed and manufactured for direct current resistance. Contact us for use of other resistances such as inductive (L) or capacitive ©.
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16.
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The switch will be broken if impact force or a greater stress than that specified is applied. Take a great care not to let the switch be subject to greater stress than specified.
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17.
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Do not apply a force from the side of the stem.
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18.
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Be sure to push the center of switch for "without-stem"type. Extreme care is required for a hinge structure type because the stem press position moves when it is pressed.
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19.
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Insert these switches to the specified mounting surface and mount them horizontally. If not mounted horizontally, these switches will malfunction.
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20.
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Use of the switches in a dusty environment may lead the dusts entering through the openings and cause imperfect contact or malfunction. Take this into account for set design.
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21.
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Corrosive gas if generated by peripheral parts of a set, malfunction such as imperfect contact may occur. Thorough investigation shall be required beforehand.
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22.
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Be aware of dust intrusion into a non dust-proof-type TACT Switch™.
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(1) Store the products as delivered, at a normal temperature and humidity, without direct sunshine and corrosive gas ambient. Use them at an earliest possible timing, not later than six months upon receipt.
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(2) After breaking the seal, keep the products in a plastic bag to shut out ambient air, store them in the same environment as above, and use them up as soon as possible.
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(3) Do not stack too many switches.
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(4) Store the key switches with the switch in the released position.
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Caution
