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IEEE802.11b/g (Small Type) Communication Module
Communication Use RF Devices Features

A small size and low profile of dimension size 8.9×8.9×1.3mm are achieved.
A small size and low profile of dimension size 8.9×8.9×1.3mm are achieved by the adoption and the Flip chip mounting and the high density surface-mounting technology of the RF bare chip parts.
For 16 bit parallel/SDIO interfaces.
Applications
Mobile phones, digital still cameras, personal digital assistants.
Product line
Model Outline dimensions
(mm)		 Volume(ml)/
Weight(g)		 Interface Frequency range
(MHz)		 Modulation
method 		Channel spacing
(MHz)		 Supply voltage
(V)		 Transmit speed
(bps)		 Input sensitivity(dBm)Output level
(dBm)		 Encryption
UGGZ3-4 8.9×8.9×1.3 0.1/0.22 SDIO 2412 to 2472 DSSS/
OFDM		 5 Vcc1: 3.3
Vcc2: 2.85
Vcc3: 1.8		 11M max./
54M max.		 -76 min.
(Datarate: 11M bps)
-65 min.
(Datarate: 54M bps)		 +15 typ.
(Datarate: 11M bps)
+13 typ.
(Datarate: 54M bps)		 WEP
TKIP
AES
WPA2
UGGZ3-5 SPI

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