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Keyboards/GlidePoint™/Disk Drive

Keyboards for Notebook PCs

  Simulation technology

GlidePoint™

  Bonding technology

  Software technology

Floppy Disk Drive

Stickpointer™
Controller/Operation panels/New Input Device

Remote Control Units

Low-profile Operation Panels

  Bonding technology

  Screen printing technology

Forcereactor™

GlideSensor™
  Electrostatic detection technology

Touchmotion™

Touch Panels
  Optical panel molding technology


 
Electrostatic detection technology GlideSensor™


Electrostatic technology utilized in GlidePoint™, GlideSensor™, and Touchmotion™, detects electrostatic capacitance change less than 1pF caused by the approach of a finger. GlidePoint™ is made up of electrodes X and Y on a multilayer board, as shown in figure below. It detects electrostatic capacitance between the electrodes.




 
Optical panel molding technology


Optical simulation and precision mold & molding technologies are integrated to realize clear, highly translucent optical panels.



Low residual stress molding by mold design based on the flow analysis is used to realize the optical panel with little birefringence.




 
Simulation technology Keyboards for Notebook PCs



Notebook PCs are becoming thinner. In order to achieve comfortable key operation, it is important to balance stroke, peak load, and the key touch hysteresis property. ALPS optimized the rubber dome form by utilizing simulation records from 3D CAD technology, over 200 trial data, and FEM analysis. The company can create a comfortable key touch in response to any need.





 
 
Bonding technology GlidePoint™ / Low-profile Operation Panels
With Film GlidePoint™, bonding the PET film and the printed wiring board firmly is essential. ALPS has pursued optimal materials and succeeded in developing a unique heat-cured resin, which firmly bonds the PET film and the printed wiring board, securing the film's silver pattern and the board's copper foil pattern at the same time. ALPS gathered all possible knowledge to develop Chip electronic components that can be surface-mounted on the PET film. The Chip electronic components are electrically connected to the circuit with an electrically conductive adhesive and fixed with a UV-cured resin. By having a consistent, mounted part for fine-pitch through-hole printing, a wide range of products can be developed.



 
 
Software technology GlidePoint™

The IC design technology and software technology of ALPS support GlidePoint™ development in response to a variety of needs. The company develops digital/analog-combined ASICs that achieve both low power consumption and high reliability, as well as developing the drivers completely within ALPS to respond to customization in terms of language and functions.
Arranging virtual scroll bars and buttons on the surface of the touch pad results in a comfortable one-finger operation.




 
 
Screen printing technology Low-profile Operation Panels


Circuit boards applied with films are often employed for small low-profile light products. ALPS supplies products that employ low-cost PET films instead of the polyimide film typically employed. Finely pitched pattern printing is achieved by circuit formation technology developed over past years. High-density wiring equivalent to polyimide film has been achieved, and combined with through-hole (double-sided) printing technology, even denser wiring is possible.





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